** Preparation for Release 3.1.0 **

[slaff]

This issue is created to collect all the tasks we need to do before the 3.1.0 release (Was 3.0.2 but this release contains major changes that should be reflected in the version number).

Expected Date: 12th of February, 2017

Source Code

• Update the API documentation and publish the update in the gh-pages branch.
• Update Sming/SmingCore/SmingCore.h
• Update Readme.md
• Merge develop into master
• Tag the source code in the master branch

Major PRs

• Custom LWIP compilation by default for 1.5 and 2.0 SDKs (Allow compilation of custom LWIP #878)
• Refactored HardwareSerial for better responsiveness and speed. Allowed the use of UART1. (HardwareSerial refactoring #894, Simplified HardwareSerial callback logic. #923)
• rBootHttpUpdate: Hooks added for signed and/or encrypted OTA (rBootHttpUpdate: Hooks added for signed and/or encrypted OTA #893). See wiki for details
• SDK 2.0 compatibility and better Spiffs mounting logic. ( Initial support for SDK 2.0 #921 )
• Initial support for YeeLight smart WiFi bulbs. ( Feature/yeelight #925 )
• AM2321 I2C sensor support ( AM2321 I2C sensor support (with example) #931 )

All merged PRs in this release can be seen from here

Pending Issues

Ideas

• Drop "official" support for SDK 1.4 (it will still work, but we should concentrate on SDK 2.0) (Added CI tests for SDK 2.0 on Linux with esp-open-sdk. #926)
• Set the compilation to use custom LWIP by default. (Use custom LWIP by default #929)

Docs ToDo

• Add compatability matrix in Readme.md (Added SDK and OS compatibility matrix. #919)
• Add more information about the custom LWIP compilation (Fix/lwip compile under OSes that are picky about % characters. #912).