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IEEE SSCS Open-Source Ecosystem “Code-a-Chip” Travel Grant Awards at ISSCC'23

List of Accepted Notebooks:

Name Affiliation Notebook Title
Yihai Zhang Tsinghua-Berkeley Shenzhen Institute, Tsinghua University China GreenRio 2: A Linux-compatible RISC-V Processor Developed with A Fully Open-Source EDA Flow
Anawin Opasatian University of Tokyo (Japan) Bernstein-Yang Modular Inversion with XLS/OpenLane
Mauricio Montanares University of Concepción (Chile) Sonar On Chip Project
Nealson Li Georgia Institute of Technology (USA) Coordinate Rotation Digital Computer (CORDIC) with OpenLane
HyungJoo Park Hanyang University (South Korea) Scan Register layout generation using laygo2
Ali Hammoud University of Michigan (USA) OpenFASoC: Digital LDO Generator
Nimish Shah KU Leuven (Belgium) DPU: DAG Processing Unit for probabilistic ML and sparse matrix algebra

Note: Many thanks everyone for your participation! We recommend to resubmit your Notebooks to the next code-a-chip Notebook competition with revisions. Stay tuned!

The International Solid-State Circuits Conference (ISSCC) 2023 Code-a-Chip Travel Grant Award is created to:

  1. Promote reproducible chip design using open-source tools and notebook-driven design flows and
  2. Enable up-and-coming talents as well as seasoned open-source enthusiasts to travel to the Conference and interact with the leading-edge chip design community.

This program is made possible by a donation from the CHIPS Alliance, a non-profit organization hosted by The Linux Foundation.